Research on the Development and Innovation of High-Quality and High-Yield Bonds in China

DOI

10.2991/978-2-38476-311-5_3How to use a DOI?

Keywords

high-yield bond; credit rating; Sci-Tech Innovation Bond; SPV M&A bond

Abstract

This paper compares the structural differences between China and the US credit bond markets. Two innovative bond varieties are creatively proposed: stock-bond compound innovative industrial bond and SPV M&A bond. It is suggested that improving the risk management and credit enhancement mechanism, provide effective risk management tools and reduce the risk of default; enrich the exit mechanism to promote the high-quality development of the bond market, and use the high-quality bond market to serve the high-quality development of China’s economy.

Copyright

© 2024 The Author(s)

Open Access

Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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TY  - CONF
AU  - Dingjia Xiao
PY  - 2024
DA  - 2024/12/01
TI  - Research on the Development and Innovation of High-Quality and High-Yield Bonds in China
BT  - Proceedings of the 2024 4th International Conference on Modern Educational Technology and Social Sciences (ICMETSS 2024)
PB  - Atlantis Press
SP  - 12
EP  - 18
SN  - 2352-5398
UR  - https://doi.org/10.2991/978-2-38476-311-5_3
DO  - 10.2991/978-2-38476-311-5_3
ID  - Xiao2024
ER  -