Effect of reflow cycles on interfacial morphology of Sn-3.0Ag-0.5Cu/Cu soldered joints during solid-state aging

DOI

10.2991/icmse-18.2018.47How to use a DOI?

Keywords

lead-free solder, intermetallic compound (IMC), reflow cycle, interfacial morphology, aging

Abstract

The morphology of intermetallic compounds (IMCs) at Sn-3.0Ag-0.5Cu/Cu interface was investigated during solid-state aging with multiple reflow cycles. Results showed the scallop shape of Cu6Sn5 becomes elongated type with an increase in the aspect ratio gradually with increasing reflow cycles. Moreover, the thicknesses of the interfacial IMCs layer all increase linearly with the square root of aging time whatever reflow soldering cycles, and the growth kinetics equations of different reflow cycles are obtained by linear regression. It confirms that the growth of all IMCs layers follows the diffusion control mechanism. It is worth to mention that the growth coefficients increase successively with the addition of reflow cycle, indicating the IMCs layer would be thicker as increasing reflow cycles. Hence, to improve the reliability of solder joint, only one reflow cycle and proper soldering time is needed.

Copyright

© 2018, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Min Qu
AU  - Tianze Cao
AU  - Yan Cui
AU  - Fengbin Liu
AU  - Zhiwei Jiao
AU  - Yuan Liu
PY  - 2018/05
DA  - 2018/05
TI  - Effect of reflow cycles on interfacial morphology of Sn-3.0Ag-0.5Cu/Cu soldered joints during solid-state aging
BT  - Proceedings of the 2018 8th International Conference on Manufacturing Science and Engineering (ICMSE 2018)
PB  - Atlantis Press
SP  - 236
EP  - 240
SN  - 2352-5401
UR  - https://doi.org/10.2991/icmse-18.2018.47
DO  - 10.2991/icmse-18.2018.47
ID  - Qu2018/05
ER  -