Simulation based on Comsol Multiphysics for analyzing the effect of different heat dissipation methods on the thermal effect of microchip

DOI

10.2991/978-94-6463-518-8_25How to use a DOI?

Keywords

Circuit Board Heat Dissipation; Multiple Physical Field Coupling; Heat Sink; Heat Convection

Abstract

Nowadays, with the flourishing development of microchip technology, the computational speed of the microchip is rising and its size is gradually shrinking. However, the heat will cause deformation of the circuit board, microchip life decline and other problems, so heat dissipation has always been a key issue restricting the development of microchips. This paper qualitatively analyses the heat production during microchip running and gives a reasonable heat dissipation solution. In this paper, A simplified model of the circuit board, including electrodes, silkscreen circuits, and microchip, was constructed, and the thickness was simplified to emphasize the temperature as well as the deformation variations of the board. the effects of ventilation conditions and the use of heat sink on the maximum temperature of the microchip and the deformation of the circuit board are tested by simulation experiments using Comsol Multiphysics with multi-physical field coupling. Increasing the heat convection exchange between the microchip and the environment, increasing the heat sink can increase the efficiency of chip heat dissipation and decrease the deformation and temperature of the microchip. This paper analyzes different heat dissipation schemes at the data level and provides a methodology for a practical analysis.

Copyright

© 2024 The Author(s)

Open Access

Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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TY  - CONF
AU  - Yunzhong Bai
PY  - 2024
DA  - 2024/09/28
TI  - Simulation based on Comsol Multiphysics for analyzing the effect of different heat dissipation methods on the thermal effect of microchip
BT  - Proceedings of the 2024 International Conference on Mechanics, Electronics Engineering and Automation (ICMEEA 2024)
PB  - Atlantis Press
SP  - 247
EP  - 260
SN  - 2352-5401
UR  - https://doi.org/10.2991/978-94-6463-518-8_25
DO  - 10.2991/978-94-6463-518-8_25
ID  - Bai2024
ER  -