Simulation Study on High-Voltage IGBT Turn-Off with Polysilicon Distributed Gate Resistance Effect
Authors
Rui Jin, Lei Cui, Chao Gong, Yu Wu
Corresponding Author
Rui Jin
Available Online January 2019.
- DOI
- 10.2991/mmssa-18.2019.19How to use a DOI?
- Keywords
- IGBT; turn-off; distributed gate resistance
- Abstract
This paper presents a device simulation study on a high-voltage 4-cell IGBT structure with a distributed gate resistance. It is shown that during turn-off, the emitter current of IGBT will demonstrate a “homogenous– non- homogeneous– re- homogeneous” evolution before the collector voltage rises. Therefore this effect will generate a small amount of local temperature rising, and will not affect the safe turn-off operation of the device on the whole.
- Copyright
- © 2019, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Rui Jin AU - Lei Cui AU - Chao Gong AU - Yu Wu PY - 2019/01 DA - 2019/01 TI - Simulation Study on High-Voltage IGBT Turn-Off with Polysilicon Distributed Gate Resistance Effect BT - Proceedings of the 2018 International Conference on Mathematics, Modeling, Simulation and Statistics Application (MMSSA 2018) PB - Atlantis Press SP - 82 EP - 85 SN - 1951-6851 UR - https://doi.org/10.2991/mmssa-18.2019.19 DO - 10.2991/mmssa-18.2019.19 ID - Jin2019/01 ER -