Proceedings of the 3rd Annual International Conference on Mechanics and Mechanical Engineering (MME 2016)

Study on the Instrument Panel Assembly Modal Analysis Basic on CAE Technology

Authors
Zhi-Kui Ma, Lin Hua, Tian-Wen Shi
Corresponding Author
Zhi-Kui Ma
Available Online December 2016.
DOI
10.2991/mme-16.2017.132How to use a DOI?
Keywords
CAE analysis, Instrument panel, Modal, Frequency.
Abstract

Modal performance of the automotive instrument panel has been studied in this article. Finite element software Hypersh/ OptiStruct has been used in modal analysis in this article. This paper first calculated the modal frequency and vibration shape of the instrument panel. Engineered modification has been applied to rise the inherentÿfrequency. The result shows this method can effectively optimize the inherentÿfrequency of the instrument panel assembly.

Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 3rd Annual International Conference on Mechanics and Mechanical Engineering (MME 2016)
Series
Advances in Engineering Research
Publication Date
December 2016
ISBN
978-94-6252-303-6
ISSN
2352-5401
DOI
10.2991/mme-16.2017.132How to use a DOI?
Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Zhi-Kui Ma
AU  - Lin Hua
AU  - Tian-Wen Shi
PY  - 2016/12
DA  - 2016/12
TI  - Study on the Instrument Panel Assembly Modal Analysis Basic on CAE Technology
BT  - Proceedings of the 3rd Annual International Conference on Mechanics and Mechanical Engineering (MME 2016)
PB  - Atlantis Press
SP  - 939
EP  - 944
SN  - 2352-5401
UR  - https://doi.org/10.2991/mme-16.2017.132
DO  - 10.2991/mme-16.2017.132
ID  - Ma2016/12
ER  -