Analysis of stress concentration phenomenon in stretchable interconnects

DOI

10.2991/meic-15.2015.173How to use a DOI?

Keywords

Stretchable electronics; stretchable interconnects; stress concentration; finite element analysis; ABAQUS

Abstract

Stretchable interconnects are essential structures in stretchable electronics. Typically, these structures are formed by metal conductors of different shapes on top of or encapsulated within a rubber material. Interfacial delamination during elongation is one of the major failures affecting the elasticity of interconnects. Stress concentration on substrate is the source of delamination. This study uses a numerical model of stretchable interconnects to analyze stress concentration phenomenon of typical structure shapes: the horseshoe, the zigzag, the U shape and the rectangle shape. The simulation is implemented by commercial finite element analysis software, ABAQUS. The simulation results demonstrate that stress concentrate area is larger at the edge of larger arc when out of plane deformation of the metal lines is small. However the geometrical configuration of the metal line shape has little effect on delamination. The phenomenon which found in this study cannot be ignored when designing metal line layouts.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Hua Lin
AU  - Kailin Pan
AU  - Fan Yang
AU  - Qing Qin
PY  - 2015/04
DA  - 2015/04
TI  - Analysis of stress concentration phenomenon in stretchable interconnects
BT  - Proceedings of the 2015 International Conference on Mechatronics, Electronic, Industrial and Control Engineering
PB  - Atlantis Press
SP  - 760
EP  - 763
SN  - 2352-5401
UR  - https://doi.org/10.2991/meic-15.2015.173
DO  - 10.2991/meic-15.2015.173
ID  - Lin2015/04
ER  -