The Higher Order Crack Tip Fields for Anti-plane Crack in Power Functionally Graded Piezoelectric Materials
Authors
Yao Dai, Xiao Chong, Jing-wen Pan
Corresponding Author
Yao Dai
Available Online April 2015.
- DOI
- 10.2991/mebe-15.2015.226How to use a DOI?
- Keywords
- higher order fields; power FGPMs; eigen-expansion method; anti-plane crack
- Abstract
The eigen-solutions of the crack tip fields for an anti-plane crack in functionally graded piezoelectric materials (FGPMs) are studied. Different from previous analyses, all material properties of the FGPM are assumed to be power-law function of y perpendicular to the crack. The crack surfaces are electrically impermeable and loaded by anti-plane shear tractions and in-plane electric displacements. The higher order crack tip fields of FGPMs are obtained by the eigen-expansion method. The stress intensity factor and electric displacement intensity factor are obtained explicitly.
- Copyright
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Yao Dai AU - Xiao Chong AU - Jing-wen Pan PY - 2015/04 DA - 2015/04 TI - The Higher Order Crack Tip Fields for Anti-plane Crack in Power Functionally Graded Piezoelectric Materials BT - Proceedings of the 2015 International Conference on Materials, Environmental and Biological Engineering PB - Atlantis Press SP - 1011 EP - 1014 SN - 2352-5401 UR - https://doi.org/10.2991/mebe-15.2015.226 DO - 10.2991/mebe-15.2015.226 ID - Dai2015/04 ER -