Variations in Hoop Stresses among Silicon Dioxide, Polystyrene and Polypropylene Carbonate Through Silicon Via Liners

DOI

10.2991/jimet-15.2015.205How to use a DOI?

Keywords

Analysis System, Interconnect, Liner, Reliability, Through Silicon Via.

Abstract

Through Silicon Via are the widely used interconnects in the semiconductors industry. They are designed in different ways to meet the market demands. These interconnect need protection from both internal and external pressures. The pressures result from heating of the components on the chip which enhances expansion and contraction. Silicon dioxide has been the commonly used Through Silicon Via liner. We propose the use of polystyrene and polypropylene carbonate as liners to reduce overdependence on silicon dioxide. We compare deformations and stresses among the materials and noted that silicon dioxide had the least deformation and hoop stress values. We did further research and realized that the latter two materials have some good properties not found in silicon dioxide so they can also serve as better liners.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Juma Mary Atieno
AU  - Xuliang Zhang
AU  - He Song bai
PY  - 2015/12
DA  - 2015/12
TI  - Variations in Hoop Stresses among Silicon Dioxide, Polystyrene and Polypropylene Carbonate Through Silicon Via Liners
BT  - Proceedings of the 2015 Joint International Mechanical, Electronic and Information Technology Conference
PB  - Atlantis Press
SP  - 1089
EP  - 1092
SN  - 2352-538X
UR  - https://doi.org/10.2991/jimet-15.2015.205
DO  - 10.2991/jimet-15.2015.205
ID  - MaryAtieno2015/12
ER  -