Strengthening of polyimide composites by SiC whiskers

DOI

10.2991/isaeece-16.2016.21How to use a DOI?

Keywords

SiC whiskers, Polyimide, Composites, Load transfer, Deposition, Pre-dispersion, High-speed mechanical stirring

Abstract

To improve the strength of the polyimide (PI), composites with SiC whiskers doping in the polyimide matrix were prepared. In order to avoid the conglobation of the whiskers, SiC whiskers pre-dispersed in the ethanol. SiC whiskers/PI composites were prepared by high-speed mechanical stirring. The resulting composites were analyzed in terms of dispersion and deposition of whiskers, mechanical performance by means of scanning electron microscope (SEM) and tensile testing respectively.TheSiC whiskers uniformly distributed in the PI matrix. And there was nearly no SiC whiskers deposition.TheSiC whiskers/PI composites showed better mechanical performance than pure PI.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Download article (PDF)

TY  - CONF
AU  - Yanmei Liu
AU  - Yan Wang
AU  - Guifu Ding
PY  - 2016/04
DA  - 2016/04
TI  - Strengthening of polyimide composites by SiC whiskers
BT  - Proceedings of the 2016 International Symposium on Advances in Electrical, Electronics and Computer Engineering
PB  - Atlantis Press
SP  - 99
EP  - 102
SN  - 2352-5401
UR  - https://doi.org/10.2991/isaeece-16.2016.21
DO  - 10.2991/isaeece-16.2016.21
ID  - Liu2016/04
ER  -