Proceedings of the 2016 International Conference on Innovative Material Science and Technology (IMST 2016)

Effect of electromagnetic field on the solidification structure of C19400 copper alloy

Authors
Baomian Li, Haitao Zhang, Jianzhong Cui
Corresponding Author
Baomian Li
Available Online November 2016.
DOI
10.2991/imst-16.2016.79How to use a DOI?
Keywords
C19400 copper alloy, electromagnetic field, solidification structure.
Abstract

The as-cast structure of C19400 copper alloy (Cu-2.32%Fe-0.035%P-0.11Zn in mass%) under electromagnetic field had been researched in this paper. It is shown that applying electromagnetic field during the solidification of C19400 copper alloy can promote columnar-to-equiaxed transition, refine grain, eutactics and Fe2P phase. The morphology of Fe2P phase changes from coarse irregular shape to fine dotlike shape. The greater the current intensity, the more obvious the above-mentioned effects.

Copyright
© 2016, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2016 International Conference on Innovative Material Science and Technology (IMST 2016)
Series
Advances in Intelligent Systems Research
Publication Date
November 2016
ISBN
978-94-6252-269-5
ISSN
1951-6851
DOI
10.2991/imst-16.2016.79How to use a DOI?
Copyright
© 2016, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Baomian Li
AU  - Haitao Zhang
AU  - Jianzhong Cui
PY  - 2016/11
DA  - 2016/11
TI  - Effect of electromagnetic field on the solidification structure of C19400 copper alloy
BT  - Proceedings of the 2016 International Conference on Innovative Material Science and Technology (IMST 2016)
PB  - Atlantis Press
SP  - 535
EP  - 539
SN  - 1951-6851
UR  - https://doi.org/10.2991/imst-16.2016.79
DO  - 10.2991/imst-16.2016.79
ID  - Li2016/11
ER  -