Deformation analysis for the superconductor-silver interface in the Bi-2223/Ag tape rolling process

DOI

10.2991/icmse-17.2017.42How to use a DOI?

Keywords

Interface; Sausaging; Bi-2223/Ag; Rolling; Modelling

Abstract

Analytical model of interface deformation behavior during rolling process was established to investigate the principle of sausaging formation, and formula involving the geometric parameters and physical properties of silver layer was derived on the basis of energy approach. Moreover, the curvature difference of interface before and after deformation was defined as evaluation factor for the interface forming quality. Numerical model of Bi-2223/Ag high temperature superconducting wires during rolling was proposed, and the effect of process parameters such as inner tube material, roller diameter and friction coefficient on the deformation behaviors of the interface in Bi-2223/Ag wire was analyzed. The results suggest that inner sheath material with high strength contributes to a better silver-super interface. Simultaneously, larger roller and small friction coefficient weaken the interface instability and obtain the final tape with high critical current density. In addition, the numerical results verify the accuracy of the theoretical derivation.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Yongjin Lu
PY  - 2017/04
DA  - 2017/04
TI  - Deformation analysis for the superconductor-silver interface in the Bi-2223/Ag tape rolling process
BT  - Proceedings of the 2017 7th International Conference on Manufacturing Science and Engineering (ICMSE 2017)
PB  - Atlantis Press
SP  - 233
EP  - 240
SN  - 2352-5401
UR  - https://doi.org/10.2991/icmse-17.2017.42
DO  - 10.2991/icmse-17.2017.42
ID  - Lu2017/04
ER  -