Proceedings of the 2015 International Conference on Material Science and Applications

Modeling and Analysis of the Dynamic Behavior for Interacting Cracks on Circular Cavities in Piezoelectric Material

Authors
Dong Li, Hui-Cong Wang
Corresponding Author
Dong Li
Available Online June 2014.
DOI
10.2991/icmsa-15.2015.78How to use a DOI?
Keywords
Radial Crack, Piezoelectric Material, Green’s Function, Dynamic Stress Intensity Factor (DSIF), SH-wave.
Abstract

The present paper is exposed theoretically to the influence on the dynamic stress intensity factor (DSIF) in the piezoelectric material model with two permeable radial cracks emanating from the edges of two circular cavities, subjected to the dynamic incident anti-plane shearing wave (SH-wave). Green’s functions are established based on complex variable and wave function expansion methods. Conjunction and crack-simulation techniques are used to evaluate DSIFs at the cracks’ tip. The problem is reduced to a series of Fredholm integral equations of first kind. The numerical results are obtained by solving the equations to show the influence of the structural geometry, and the wave frequencies of incident wave on the dimensionless DSIFs.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2015 International Conference on Material Science and Applications
Series
Advances in Physics Research
Publication Date
June 2014
ISBN
978-94-62520-75-2
ISSN
2352-541X
DOI
10.2991/icmsa-15.2015.78How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Dong Li
AU  - Hui-Cong Wang
PY  - 2014/06
DA  - 2014/06
TI  - Modeling and Analysis of the Dynamic Behavior for Interacting Cracks on Circular Cavities in Piezoelectric Material
BT  - Proceedings of the 2015 International Conference on Material Science and Applications
PB  - Atlantis Press
SP  - 432
EP  - 437
SN  - 2352-541X
UR  - https://doi.org/10.2991/icmsa-15.2015.78
DO  - 10.2991/icmsa-15.2015.78
ID  - Li2014/06
ER  -