A new threshold segmentation algorithm for segmenting micro-focus X-ray BGA solder joint image

DOI

10.2991/icitmi-15.2015.197How to use a DOI?

Keywords

micro-focus X-ray BGA solder joint image, threshold segmentation algorithm, mathematical morphology

Abstract

Grid Array Ball (BGA) has been used in the production of electronic devices and components because of its small size, high I / O port density and so on. However, BGA solder joint defects will reduce the performance of the motherboard. Because micro-focus X-ray BGA solder joint image has a large number of redundant defect detection information (such as line-bridge in BGA packaging device), we propose an image segmentation method based on the combination of the mean area value of independent connected region as the threshold and mathematical morphology. The results show that the proposed algorithm can separate the solder joint and the background successfully and realize the accurate segmentation of the joint area.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Hui Wang
AU  - Dan Liu
PY  - 2015/10
DA  - 2015/10
TI  - A new threshold segmentation algorithm for segmenting micro-focus X-ray BGA solder joint image
BT  - Proceedings of the 4th International Conference on Information Technology and Management Innovation
PB  - Atlantis Press
SP  - 1174
EP  - 1177
SN  - 2352-538X
UR  - https://doi.org/10.2991/icitmi-15.2015.197
DO  - 10.2991/icitmi-15.2015.197
ID  - Wang2015/10
ER  -