Effects of Solder Voids on Microwave Transmission Performance in Passive Circuits

DOI

10.2991/iccsae-15.2016.145How to use a DOI?

Keywords

soldering; void; grounding; signal transmission; HFSS.

Abstract

Grounding is an important technology of microwave circuits. Soldering process can realize the grounding of microwave chip. However, the solder voids in soldering can make the reliability of grounding worse, deteriorating heat conduction performance and conductive properties, resulting in an error in signal transmission and significantly reduce the transmission performance of microwave signal. As the device operating frequency goes higher, solder voids can lead to serious signal integrity problems, for this reason, influence of different positions, sizes and number of void in soldering on signal transmission performance of microwave were investigated. The result shows that the void close to the feeding port has the greatest influence on the signal transmission performance, the signal transmission performance worsens with the volume of void enlarging, in addition, below the transmission line, with the increasing in number of voids, the signal transmission performance is deteriorated.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Yingxia Qiu
AU  - Xuelin Peng
AU  - Jingsheng Cheng
AU  - Zhixian Min
PY  - 2016/02
DA  - 2016/02
TI  - Effects of Solder Voids on Microwave Transmission Performance in Passive Circuits
BT  - Proceedings of the 2015 5th International Conference on Computer Sciences and Automation Engineering
PB  - Atlantis Press
SP  - 774
EP  - 779
SN  - 2352-538X
UR  - https://doi.org/10.2991/iccsae-15.2016.145
DO  - 10.2991/iccsae-15.2016.145
ID  - Qiu2016/02
ER  -