Proceedings of the 2nd International Conference on Contemporary Education, Social Sciences and Humanities (ICCESSH 2017)

Research on Applied Undergraduate Course Reform Based on Makerspace

Authors
Nana Shang
Corresponding Author
Nana Shang
Available Online June 2017.
DOI
10.2991/iccessh-17.2017.25How to use a DOI?
Keywords
makerspace; applied undergraduate; mass innovation; STEAM vocational education
Abstract

Applied undergraduate aims at training high quality applied talents who can adapt to economic development. In the era of "mass entrepreneurship and innovation", applied undergraduate is required to train talents with high quality of entrepreneurship and innovation. Maker Education becomes the theme. Makerspace is the subject of Maker Education. The booming of makerspace has great influence on the economy of our country. The inevitable trend of educational reform is to analyze characteristics of makerspace and reform the courses of applied undergraduate.

Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2nd International Conference on Contemporary Education, Social Sciences and Humanities (ICCESSH 2017)
Series
Advances in Social Science, Education and Humanities Research
Publication Date
June 2017
ISBN
978-94-6252-351-7
ISSN
2352-5398
DOI
10.2991/iccessh-17.2017.25How to use a DOI?
Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Nana Shang
PY  - 2017/06
DA  - 2017/06
TI  - Research on Applied Undergraduate Course Reform Based on Makerspace
BT  - Proceedings of the 2nd International Conference on Contemporary Education, Social Sciences and Humanities (ICCESSH 2017)
PB  - Atlantis Press
SP  - 116
EP  - 118
SN  - 2352-5398
UR  - https://doi.org/10.2991/iccessh-17.2017.25
DO  - 10.2991/iccessh-17.2017.25
ID  - Shang2017/06
ER  -