Preparation of PMMA/PGMA Blend to Apply for Metallographic Cross Section of Printed Circuit Board

DOI

10.2991/ame-17.2017.46How to use a DOI?

Keywords

PMMA/PGMA blend, MMA, GMA, PCB, Metallographic cross section.

Abstract

Poly (methyl methacrylate)/poly (glycidyl methacrylate) (PMMA/PGMA) blend was prepared with the reaction of PMMA, glycidyl methacrylate (GMA) and methyl methacrylate (MMA) at room temperature. Effects of the proportions of MMA and GMA were investigated to analyze the performance of PMMA/PGMA blend. When the weight fraction of GMA in GMA/MMA was 0.25, PMMA/PGMA blend exhibited good performance as curing time of 29 min, volume shrinkage of 9.83%, bending strength of 50 MPa, tensile strength of 31 MPa and bonding strength of 1.52 MPa. PMMA/PGMA blend could well cover the cross section of printed circuit board.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Xue-Mei He
AU  - Tao Shen
AU  - Shou-Xu Wang
AU  - Yuan-Ming Chen
AU  - Huai-Wu Zhang
AU  - Li-Jun Gong
AU  - Bei Chen
AU  - Wei He
PY  - 2017/04
DA  - 2017/04
TI  - Preparation of PMMA/PGMA Blend to Apply for Metallographic Cross Section of Printed Circuit Board
BT  - Proceedings of the 3rd Annual International Conference on Advanced Material Engineering (AME 2017)
PB  - Atlantis Press
SP  - 265
EP  - 271
SN  - 2352-5401
UR  - https://doi.org/10.2991/ame-17.2017.46
DO  - 10.2991/ame-17.2017.46
ID  - He2017/04
ER  -