Analysis of Materials and Processes Affecting SMT Printing Quality

DOI

10.2991/wartia-18.2018.9How to use a DOI?

Keywords

material and processes, stencil and printer, affect SMT printing quality.

Abstract

This paper introduces the key problems affacting SMT printing quality. It relates the materials and processes, such as, stencil designing and manufacturing, aperture size, etc. The paper discusses the solder paste and the printer, which can affect the quality of printing. Automatic printers can be programmed for sueegee travel speed, squeegee pressure, and the frequency of cleaning the underside of stencil, and the vision system are key factors affecting the quality of SMT printing.

Copyright

© 2018, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Xiaoming Hu
PY  - 2018/09
DA  - 2018/09
TI  - Analysis of Materials and Processes Affecting SMT Printing Quality
BT  - Proceedings of the 4th Workshop on Advanced Research and Technology in Industry (WARTIA 2018)
PB  - Atlantis Press
SP  - 39
EP  - 45
SN  - 2352-5401
UR  - https://doi.org/10.2991/wartia-18.2018.9
DO  - 10.2991/wartia-18.2018.9
ID  - Hu2018/09
ER  -