Proceedings of the 3rd Workshop on Advanced Research and Technology in Industry (WARTIA 2017)

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Multi-chip assembly based on SiP technology

Authors
Xuchun Gan, Jiang Deng
Corresponding Author
Xuchun Gan
Available Online November 2017.
DOI
10.2991/wartia-17.2017.84How to use a DOI?
Keywords
SIP, Multi-chip, Abaqus, package.
Abstract

System in package（ SIP） is characterized by any combination of more than one active electronic component of different functionality plus optionally passives and other devices assembled preferred into a single standard package that provides multiple functions associated with a system .this paper introduces the classification and superiority of SIP encapsulation through the research and development of system encapsulation technology, and discusses the simulation and application of Multi - chip SiP package.

Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 3rd Workshop on Advanced Research and Technology in Industry (WARTIA 2017)
Series
Advances in Engineering Research
Publication Date
November 2017
ISBN
978-94-6252-409-5
ISSN
2352-5401
DOI
10.2991/wartia-17.2017.84How to use a DOI?
Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

risenwbib
TY  - CONF
AU  - Xuchun Gan
AU  - Jiang Deng
PY  - 2017/11
DA  - 2017/11
TI  - Multi-chip assembly based on SiP technology
BT  - Proceedings of the 3rd Workshop on Advanced Research and Technology in Industry (WARTIA 2017)
PB  - Atlantis Press
SP  - 443
EP  - 447
SN  - 2352-5401
UR  - https://doi.org/10.2991/wartia-17.2017.84
DO  - 10.2991/wartia-17.2017.84
ID  - Gan2017/11
ER  -