Proceedings of the 2019 International Conference on Modeling, Simulation, Optimization and Numerical Techniques (SMONT 2019)

<Previous Article In Volume
Next Article In Volume>

Study on the Acoustic Characteristics of Headphone with ECM Simulation and Reverse Engineering

Authors
H.W. Chen, S.G. Li, Shuchien Wu, Y.C. Liu
Corresponding Author
Y.C. Liu
Available Online April 2019.
DOI
10.2991/smont-19.2019.9How to use a DOI?
Keywords
reverse engineering; equivalent circuit model
Abstract

In this study, DENON monitor headphones were the investigated target. Through equivalent circuit model, complete and accurate acoustic properties were obtained, with extension of this model to include the influence of front and rear chambers and assembled components, allowing for comprehensive headphone system simulation. Results of simulation and actual measurements were very close. In addition, reverse engineering technology, 3D printing, was used to reproduce the chambers and other components of the headphone system, except to the microspeaker. Fabricated headphone acoustic properties were highly similar to those of the factory produced headphones. This indicates the suitability and feasibility of earphone system development through reverse engineering. Loss was noted at low frequency. This was due to the ventilation materials of the front frame connecting the rear and front chambers. Overall, equivalent circuit simulation of headphone system with 3D printer technology can lead to results that resemble the acoustic properties of headphones sold on the market. The results of this study can be applied to parameter analysis and verification, as well as system development.

Copyright
© 2019, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Download article (PDF)

<Previous Article In Volume
Next Article In Volume>
Volume Title
Proceedings of the 2019 International Conference on Modeling, Simulation, Optimization and Numerical Techniques (SMONT 2019)
Series
Advances in Intelligent Systems Research
Publication Date
April 2019
ISBN
978-94-6252-712-6
ISSN
1951-6851
DOI
10.2991/smont-19.2019.9How to use a DOI?
Copyright
© 2019, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

risenwbib
TY  - CONF
AU  - H.W. Chen
AU  - S.G. Li
AU  - Shuchien Wu
AU  - Y.C. Liu
PY  - 2019/04
DA  - 2019/04
TI  - Study on the Acoustic Characteristics of Headphone with ECM Simulation and Reverse Engineering
BT  - Proceedings of the 2019 International Conference on Modeling, Simulation, Optimization and Numerical Techniques (SMONT 2019)
PB  - Atlantis Press
SP  - 34
EP  - 37
SN  - 1951-6851
UR  - https://doi.org/10.2991/smont-19.2019.9
DO  - 10.2991/smont-19.2019.9
ID  - Chen2019/04
ER  -