Properties of SnAgCu solders bearing Al nanoparticles

DOI

10.2991/peee-15.2015.49How to use a DOI?

Keywords

Lead-free solder, Wettability, N2 atmosphere, Mechanical property.

Abstract

In order to enhance the properties of SnAgCu lead-free solders, the Al nanoparticles was selected as the additives. The effects of Al nanoparticles on wettability and mechanical properties of solder and solder joints were studied. The results showed that a small amount of Al can enhance the wettability of SnAgCu solders. With the N2 atmosphere, the wettability of SnAgCu-xAl can be increased obviously, which can be attributed to the N2 can resist the oxidation of molten solder. Combing different fluxes, the wettability of lead-free solder can represent variation, the suitable flux can improve the wettability of SnAgCu-xAl solders. Moreover, the mechanical property of solders can be improved obviously with the addition of Al nanoparticles.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - L. Zhang
AU  - L. Sun
AU  - Y.H. Guo
AU  - Y. Min
PY  - 2015/04
DA  - 2015/04
TI  - Properties of SnAgCu solders bearing Al nanoparticles
BT  - Proceedings of the 2015 International Conference on Power Electronics and Energy Engineering
PB  - Atlantis Press
SP  - 185
EP  - 187
SN  - 2352-5401
UR  - https://doi.org/10.2991/peee-15.2015.49
DO  - 10.2991/peee-15.2015.49
ID  - Zhang2015/04
ER  -