Simulation Analysis of Vertical Interconnection Column Misalignment during LTCC Laminating Process

DOI

10.2991/mmeceb-15.2016.17How to use a DOI?

Keywords

LTCC, laminating process, vertical interconnection column, misalignment, simulation.

Abstract

A three-dimensional model of LTCC microwave component was built by the finite element software ANSYS, and the influence of LTCC laminating process parameters to vertical interconnection column misalignment was studied by simulation analysis. Results show that the closer to the edge of component, the greater vertical interconnection column misalignment. Pressure is the main factor that leads to the misalignment of vertical interconnection column. Choose laminating process parameters combination by pressure of 10 MPa, temperature of 90 and time of 6 min, the vertical interconnection column misalignment is 2.92%, down to below 3%.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Tianhong Luo
AU  - Dejian Zhou
PY  - 2015/12
DA  - 2015/12
TI  - Simulation Analysis of Vertical Interconnection Column Misalignment during LTCC Laminating Process
BT  - Proceedings of the 2015 2nd International Conference on Machinery, Materials Engineering, Chemical Engineering and Biotechnology
PB  - Atlantis Press
SP  - 81
EP  - 85
SN  - 2352-5401
UR  - https://doi.org/10.2991/mmeceb-15.2016.17
DO  - 10.2991/mmeceb-15.2016.17
ID  - Luo2015/12
ER  -