Circuit design of Track-And-Hold Amplifier in Ultra-High-speed Folding-Interpolating ADC
- DOI
- 10.2991/mmebc-16.2016.322How to use a DOI?
- Keywords
- Track-And-Hold Amplifier(THA); linearity; open-loop structure; switch emitter follower sampling switch; feed-through compensation circuit
- Abstract
Among the designs of ultra-high-speed analog to digital converter, folding-interpolating structure has great advantages in control of chip area and power dissipation. But the frequency-doubled effect of folding-interpolating ADC will restrict dynamic performances of ADC, such as bandwidth and linearity, etc. However, introducing Track-And-Hold Amplifier(THA) into folding-interpolating ADC can ease these shortages effectively, and thus improve dynamic performances of ADC. The structure of THA adopts open-loop structure, which could help realize the request of high speed without the influence of feedback circuit. To improve the circuit linearity, the input buffer adopts open-loop linearization technology and the output buffer adopts method of compensation and cancellation. Sampling switch also choose switch emitter follower sampling switch with greater dynamic performances. By introducing feed-through compensation capacitance, the input signal and hold signal can be completely separated, which could also help improve dynamic performances of circuit. Finally, the designed THA is taken a simulation with 3GHz clock frequency and 500MHz input frequency. The results of the simulation show that the THA can keep great dynamic performances even in ultra-high clock frequency, which lays solid foundation for further design of ultra-high-speed folding-interpolating ADC.
- Copyright
- © 2016, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Yongcong Liu AU - Jianye Wang AU - Hao Ding PY - 2016/06 DA - 2016/06 TI - Circuit design of Track-And-Hold Amplifier in Ultra-High-speed Folding-Interpolating ADC BT - Proceedings of the 2016 6th International Conference on Machinery, Materials, Environment, Biotechnology and Computer PB - Atlantis Press SP - 1585 EP - 1590 SN - 2352-5401 UR - https://doi.org/10.2991/mmebc-16.2016.322 DO - 10.2991/mmebc-16.2016.322 ID - Liu2016/06 ER -