Proceedings of the 2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering

3-D Steady Temperature Field in a Laminated Rectangular Plate

Authors
Hai Qian, Ding Zhou, Weiqing Liu, Hai Fang
Corresponding Author
Hai Qian
Available Online November 2014.
DOI
10.2991/meic-14.2014.285How to use a DOI?
Keywords
Three-dimensional temperature field; Laminated plate; Exact solution; Displacement and stress; Transfer matrix method
Abstract

According to the exact three-dimensional (3D) thermal theory, the steady temperature distribution in a laminated rectangular plate with zero temperature conditions on four lateral surfaces was studied. An analytical method was developed to solve the temperature field in the plate. Firstly, the general solution of the temperature field in a single-layer rectangular plate, which exactly satisfies the governing thermal differential equation, was derived out. Then, the temperature and heat flux relationships between the upper surface and the lower surface of the single-layer plate were obtained. Based on the continuity of the temperature and the heat flux on the interface of two adjacent layers, the temperature and the heat flux between the lowest layer and the top layer of the laminated plate were recursively obtained by using the transfer matrix method. The unknown coefficients in the solutions for every layer were uniquely determined by the use of the temperature conditions at the upper and lower surfaces of the plate. The temperature distribution in the laminated plate was given by substituting the unknown coefficients obtained back to the recurrent formulae and the solutions. The convergence of the solutions has been checked based on the number of series term. Comparing the results with those obtained from the finite element method, the accuracy and correctness of the present method were demonstrated. Finally, the effects of surface temperatures, thickness, layer number and material properties of the plate on the temperature distribution were discussed in detail.

Copyright
© 2014, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering
Series
Advances in Engineering Research
Publication Date
November 2014
ISBN
978-94-62520-42-4
ISSN
2352-5401
DOI
10.2991/meic-14.2014.285How to use a DOI?
Copyright
© 2014, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Hai Qian
AU  - Ding Zhou
AU  - Weiqing Liu
AU  - Hai Fang
PY  - 2014/11
DA  - 2014/11
TI  - 3-D Steady Temperature Field in a Laminated Rectangular Plate
BT  - Proceedings of the 2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering
PB  - Atlantis Press
SP  - 1267
EP  - 1271
SN  - 2352-5401
UR  - https://doi.org/10.2991/meic-14.2014.285
DO  - 10.2991/meic-14.2014.285
ID  - Qian2014/11
ER  -