Further research on the coupled Influence of Temperature and Stress Field to PCB' Modal

DOI

10.2991/mecs-17.2017.40How to use a DOI?

Keywords

coupled influence, temperature field, stress field, PCB's modal.

Abstract

The coupling analysis of temperature and vibration has been an important branch of domestic and international research. Influence of Temperature and Stress Field to PCB' Modal has been described in previous articles [1]. In this paper, vibration stress analysis method based on ANSYS considering temperature field and thermal stress field is introduced. Further research on the coupled influence of temperature and stress field to PCB' modal is analyzed. And the temperature field, stress field and the coupled Influence on PCB's modal were compared, which provide a reference for the PCB design and modal analysis in the future.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Qin Luo
AU  - Ke Yao
AU  - Chuangmian Huang
PY  - 2016/06
DA  - 2016/06
TI  - Further research on the coupled Influence of Temperature and Stress Field to PCB' Modal
BT  - Proceedings of the 2017 2nd International Conference on Machinery, Electronics and Control Simulation (MECS 2017)
PB  - Atlantis Press
SN  - 2352-5401
UR  - https://doi.org/10.2991/mecs-17.2017.40
DO  - 10.2991/mecs-17.2017.40
ID  - Luo2016/06
ER  -