The Activator Optimization of Low-temperature SnBi Lead-free Solder Paste
Authors
Yan Jiang, Ke Shan, Li-da Sun, Zi-jing Li, Rui-ming Xiao
Corresponding Author
Yan Jiang
Available Online April 2015.
- DOI
- 10.2991/mebe-15.2015.196How to use a DOI?
- Keywords
- Lead-free solder paste; activator; performance
- Abstract
The optimization of activator used in SnBi lead-free solder paste were carried out by welding experiments with the spreadability and the spot morphology as the main comment indexes.And the properties of the composite activator which was mixed by two activator possessing good performances were studied. The results indicated that the pastes with succinic acid and salicylic acid for as single activator have low wettability, the surface is easily oxidized;When (succinic acid : salicylic acid) is 2:3,the solder paste has good weldability and the spreadabilities are 83%.The appearance of spots is regular,plump,beamy and less surface oxide.
- Copyright
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Yan Jiang AU - Ke Shan AU - Li-da Sun AU - Zi-jing Li AU - Rui-ming Xiao PY - 2015/04 DA - 2015/04 TI - The Activator Optimization of Low-temperature SnBi Lead-free Solder Paste BT - Proceedings of the 2015 International Conference on Materials, Environmental and Biological Engineering PB - Atlantis Press SP - 877 EP - 880 SN - 2352-5401 UR - https://doi.org/10.2991/mebe-15.2015.196 DO - 10.2991/mebe-15.2015.196 ID - Jiang2015/04 ER -