Die to Package Interconnection Materials and Technologies

DOI

10.2991/mebe-15.2015.124How to use a DOI?

Keywords

Interconnection technology; flip chip; through-silicon via(TSV); interconnection materials

Abstract

This article introduced the technologies of die to package .these mainly including wire bonding(WB),tape-automated bonding(TAB),and flip chip(FC).the most common wire bonding technique is ball bonding. This is the foundation of the others .at the end parts, the paper illustrated the new interconnection technology –TSV, it bring us from 2D to 3D interconnection times.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Xiaoming Hu
PY  - 2015/04
DA  - 2015/04
TI  - Die to Package Interconnection Materials and Technologies
BT  - Proceedings of the 2015 International Conference on Materials, Environmental and Biological Engineering
PB  - Atlantis Press
SP  - 538
EP  - 544
SN  - 2352-5401
UR  - https://doi.org/10.2991/mebe-15.2015.124
DO  - 10.2991/mebe-15.2015.124
ID  - Hu2015/04
ER  -