Proceedings of the 2015 International Conference on Materials, Environmental and Biological Engineering

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Die to Package Interconnection Materials and Technologies

Authors
Xiaoming Hu
Corresponding Author
Xiaoming Hu
Available Online April 2015.
DOI
10.2991/mebe-15.2015.124How to use a DOI?
Keywords
Interconnection technology; flip chip; through-silicon via(TSV); interconnection materials
Abstract

This article introduced the technologies of die to package .these mainly including wire bonding(WB),tape-automated bonding(TAB),and flip chip(FC).the most common wire bonding technique is ball bonding. This is the foundation of the others .at the end parts, the paper illustrated the new interconnection technology –TSV, it bring us from 2D to 3D interconnection times.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2015 International Conference on Materials, Environmental and Biological Engineering
Series
Advances in Engineering Research
Publication Date
April 2015
ISBN
10.2991/mebe-15.2015.124
ISSN
2352-5401
DOI
10.2991/mebe-15.2015.124How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

risenwbib
TY  - CONF
AU  - Xiaoming Hu
PY  - 2015/04
DA  - 2015/04
TI  - Die to Package Interconnection Materials and Technologies
BT  - Proceedings of the 2015 International Conference on Materials, Environmental and Biological Engineering
PB  - Atlantis Press
SP  - 538
EP  - 544
SN  - 2352-5401
UR  - https://doi.org/10.2991/mebe-15.2015.124
DO  - 10.2991/mebe-15.2015.124
ID  - Hu2015/04
ER  -