Proceedings of the 2019 International Conference on Mathematics, Big Data Analysis and Simulation and Modelling (MBDASM 2019)

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The SMT Solder Joint Quality Inspection Based on Image Surface Visual Restoration

Authors
Nan Yu, Jing Zhang
Corresponding Author
Nan Yu
Available Online October 2019.
DOI
10.2991/mbdasm-19.2019.27How to use a DOI?
Keywords
SMT solder joint; illumination model; shape from shading; three-dimensional quality information
Abstract

The emergence of surface mount technology (SMT) has created new challenges. The most challenging is the need for more capable system to monitor the product quality. Currently, the most popular method is based on machine vision for automated optical inspection (AOI). But they generally only work in 2D testing mode, cannot make a more objective assessment for solder joints. This paper describes a three-dimensional (3D) inspection system based on recovery of the surface of solder joints. Contents include four parts: combinate wavelet packet image denoising, and different filtering methods, the mixed denoising method of SMT solder joint image is studied; the 3D illumination model suitable for SMT solder joint reconstruction is presented; based on SFS technology, the 3D reconstruction technology of solder joint was studied; the 3D solid model and morphological parameters of solder joint were obtained. This paper resolved the problem of SMT solder joint 3D quality information automatic extraction. The results can provide 3D quality information for SMT solder joint quality comparison, analysis and intelligence discrimination of solder joint quality.

Copyright
© 2019, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2019 International Conference on Mathematics, Big Data Analysis and Simulation and Modelling (MBDASM 2019)
Series
Advances in Computer Science Research
Publication Date
October 2019
ISBN
978-94-6252-811-6
ISSN
2352-538X
DOI
10.2991/mbdasm-19.2019.27How to use a DOI?
Copyright
© 2019, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

risenwbib
TY  - CONF
AU  - Nan Yu
AU  - Jing Zhang
PY  - 2019/10
DA  - 2019/10
TI  - The SMT Solder Joint Quality Inspection Based on Image Surface Visual Restoration
BT  - Proceedings of the 2019 International Conference on Mathematics, Big Data Analysis and Simulation and Modelling (MBDASM 2019)
PB  - Atlantis Press
SP  - 119
EP  - 122
SN  - 2352-538X
UR  - https://doi.org/10.2991/mbdasm-19.2019.27
DO  - 10.2991/mbdasm-19.2019.27
ID  - Yu2019/10
ER  -