Research on high density SMT reliability of aerospace products

DOI

10.2991/jimet-15.2015.155How to use a DOI?

Keywords

high density aerospace products BGA reliability

Abstract

High density assembly of aerospace electronics equipment is an important direction of research linking technology. Based on the experiment, the paper complete the solder of high density aerospace products under different welding parameters , including PBGA and CBGA in different sizes. Secondly, execute the PCB board to thermal cycle test and vibration test which was welded under different process parameters, and finally through the Metallurgical Microscopy and scanning electron microscope finished the analysis. In the experimental results, found that it contribute to the formation of Cu/Sn alloy if the peak temperature value is higher than 220 for at least two seconds. The form of Cu/Sn alloy will improve the reliability of the solder joints.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Xuming Liu
AU  - Baiyang Cao
AU  - Yin Xu
AU  - Ran Xiao
AU  - Hailong Zhao
PY  - 2015/12
DA  - 2015/12
TI  - Research on high density SMT reliability of aerospace products
BT  - Proceedings of the 2015 Joint International Mechanical, Electronic and Information Technology Conference
PB  - Atlantis Press
SP  - 831
EP  - 836
SN  - 2352-538X
UR  - https://doi.org/10.2991/jimet-15.2015.155
DO  - 10.2991/jimet-15.2015.155
ID  - Liu2015/12
ER  -