Heat transfer enhancement for PCM-based heat storage with plate fins

DOI

10.2991/iwmecs-15.2015.135How to use a DOI?

Keywords

PCM, numerical simulation, heat storage, heat transfer enhancement.

Abstract

The low thermal conductivity of phase change material (PCM) is the main resistance of heat transfer in latent storage system. Characterization of melting process in a PCM-based heat sink with plate fin type thermal conductivity enhancers is numerically studied in this paper. Detailed parametric investigations of plate fins are performed to find the effect on melting time. The results showed that decreasing the pitch of fins resulted in an appreciable increase in overall thermal performance. Increasing the fin thickness and conductivity only gave a slight improvement.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Binbin Ke
AU  - Xinnan Song
PY  - 2015/10
DA  - 2015/10
TI  - Heat transfer enhancement for PCM-based heat storage with plate fins
BT  - Proceedings of the 2015 2nd International Workshop on Materials Engineering and Computer Sciences
PB  - Atlantis Press
SP  - 674
EP  - 677
SN  - 2352-538X
UR  - https://doi.org/10.2991/iwmecs-15.2015.135
DO  - 10.2991/iwmecs-15.2015.135
ID  - Ke2015/10
ER  -