Research on High-speed PCB Design Based on Signal Integrity Analysis

DOI

10.2991/isrme-15.2015.402How to use a DOI?

Keywords

PCB Design; High Speed; Signal Integrity Analysis; Review Report

Abstract

With the development of manufacturing techniques and hardware devices, the need for high-speed chips is bursting. As a review report, we analyze the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this area are very rich and highly education during his long scientific career based on Professor Clayton Paul's literary creation also consider the inclusion variability of parameters, it is shown how statistical simulation can be affordable by the recently introduced stochastic method. As the final conclusion, we take into consideration of the necessity of practical training of designers and an experience relying on realistic PCB demonstrators is illustrated and discussed.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Ying Zhao
PY  - 2015/04
DA  - 2015/04
TI  - Research on High-speed PCB Design Based on Signal Integrity Analysis
BT  - Proceedings of the 2015 International Conference on Intelligent Systems Research and Mechatronics Engineering
PB  - Atlantis Press
SP  - 1956
EP  - 1959
SN  - 1951-6851
UR  - https://doi.org/10.2991/isrme-15.2015.402
DO  - 10.2991/isrme-15.2015.402
ID  - Zhao2015/04
ER  -