The Residual Stress Simulation Analysis of the Vacuum Eutectic Soldering for Metal and LTCC Substrate

DOI

10.2991/isrme-15.2015.318How to use a DOI?

Keywords

LTCC Substrate; Residual Stress; Numerical Simulation; Thermal-Structure Coupling

Abstract

A numerical simulation analysis model of the Metal/LTCC (Low Temperature Co-fired Ceramic) substrate vacuum eutectic soldering was built, through the study for the vacuum eutectic soldering process. Then making a thermal-structure coupling analysis for this model to research the residual stress distribution, and discuss the pressure, plating thickness and cooling rate impact for the soldering residual stress. Calculations indicate that residual stress at the interface between heterogeneous materials is bigger, and solder angular position, where induce the interface crack easily, exists stress concentration, due to the metal and LTCC substrate material mechanics performance does not match. Cooling rate, plating thickness and pressure have influence on the residual stress, and this conclusion have certain reference significance for optimizing and improving the Metal/LTCC substrate vacuum eutectic soldering process.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Chuanliang Wei
AU  - Dejian Zhou
PY  - 2015/04
DA  - 2015/04
TI  - The Residual Stress Simulation Analysis of the Vacuum Eutectic Soldering for Metal and LTCC Substrate
BT  - Proceedings of the 2015 International Conference on Intelligent Systems Research and Mechatronics Engineering
PB  - Atlantis Press
SP  - 1573
EP  - 1577
SN  - 1951-6851
UR  - https://doi.org/10.2991/isrme-15.2015.318
DO  - 10.2991/isrme-15.2015.318
ID  - Wei2015/04
ER  -