Study of Relationship between Sintering Process Parameters of LTCC and Substrate Warpage Degree

DOI

10.2991/isrme-15.2015.316How to use a DOI?

Keywords

LTCC; Sintering; defects; Simulation; Warpage degree.

Abstract

Many factors of sintering process related to LTCC (Low Temperature Co-Fired Ceramic) substrate warpage defects. In this paper, the relationship between LTCC sintering process parameters and the substrate warpage defects were studied through the hot - structure coupling finite element simulation method. It took RF devices LTCC substrate as the research object. The simulation analysis model of the LTCC substrate in sintering process environment had been established. It adopted orthogonal test table L9 (34) design nine kinds of different parameter combinations of LTCC substrate sintering process environment, Which select temperature-increasing rate, binder removal holding time, sintering holding time and cooling-rate four process parameters for the four key factors respectively from three levels. The sintering process of LTCC for hot - structure coupling finite element simulation was analyzed by Ansys which is a finite element analysis software, and the orthogonal experimental warpage degree were obtained. The relationship between sintering process parameters and the substrate warpage defects was obtained base on the range analysis of the orthogonal experiment simulation results. The results show that the temperature-increasing rate is the main factor which lead to the LTCC substrate warpage defects. And with the increase of temperature-increasing rate the warpage degree is also increasing, while the influence of the cooling speed is small. The relationship between LTCC substrate sintering process parameters and the substrate warp degree of can do guidance and reference for practical production.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Zhaowei Wang
AU  - Zhaohua Wu
PY  - 2015/04
DA  - 2015/04
TI  - Study of Relationship between Sintering Process Parameters of LTCC and Substrate Warpage Degree
BT  - Proceedings of the 2015 International Conference on Intelligent Systems Research and Mechatronics Engineering
PB  - Atlantis Press
SP  - 1564
EP  - 1568
SN  - 1951-6851
UR  - https://doi.org/10.2991/isrme-15.2015.316
DO  - 10.2991/isrme-15.2015.316
ID  - Wang2015/04
ER  -