Proceedings of the 2017 7th International Conference on Manufacturing Science and Engineering (ICMSE 2017)

Study on thermal curing motivating volcanic activity of rich-silicon IOTP

Authors
Zhigang Zhu, Shunkai Li, Beixing Li
Corresponding Author
Zhigang Zhu
Available Online April 2017.
DOI
10.2991/icmse-17.2017.32How to use a DOI?
Keywords
Thermal curing; iron ore tailing; volcanic activity; mortar; autoclaved.
Abstract

order to study the influences of different thermal curing methods on volcanic activity and mechanism of rich-silicon iron ore tailing powder (IOTP). Four different specific surface area of IOTP cured in different conditions were tested, at the same time, the strength, pore size distribution and hydration product were measured.Test results show that IOTP do not have activity cured by room temperature, it shows different degrees of volcanic activity cured by thermal conditions, especially in autoclaved condition. Hot-wet curing systems can obviously reduce the porosity and pore diameter size of IOTP mortars, improve the compactness of hydration products at the same time, the autoclaved curing systems is the best. Cured in autoclaved condition, the strength of IOTP mortars is the highest when the dosage of IOTP is 10%, but the pore size distribution is the best when the content of IOTP is 30%.

Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2017 7th International Conference on Manufacturing Science and Engineering (ICMSE 2017)
Series
Advances in Engineering Research
Publication Date
April 2017
ISBN
978-94-6252-327-2
ISSN
2352-5401
DOI
10.2991/icmse-17.2017.32How to use a DOI?
Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Zhigang Zhu
AU  - Shunkai Li
AU  - Beixing Li
PY  - 2017/04
DA  - 2017/04
TI  - Study on thermal curing motivating volcanic activity of rich-silicon IOTP
BT  - Proceedings of the 2017 7th International Conference on Manufacturing Science and Engineering (ICMSE 2017)
PB  - Atlantis Press
SP  - 172
EP  - 179
SN  - 2352-5401
UR  - https://doi.org/10.2991/icmse-17.2017.32
DO  - 10.2991/icmse-17.2017.32
ID  - Zhu2017/04
ER  -