Proceedings of the 2015 3rd International Conference on Machinery, Materials and Information Technology Applications

Effect of Pretreatment on Crushing Process of Waste Phone's Circuit Boards by Mechanical–physical Method

Authors
Hongjun Liu, Zhengdong Qi
Corresponding Author
Hongjun Liu
Available Online November 2015.
DOI
10.2991/icmmita-15.2015.146How to use a DOI?
Keywords
Waste Phone's Circuit Board; Crushing; Liberation; Pretreatment; Mechanical–physical Method
Abstract

The crushing effect of waste phone's circuit boards by mechanical–physical method under different pretreatment processes (without pretreatment, disassembling electrical components, heating treatment) was investigated. The composition, mass distribution, feature, liberation degree of crushed products were analyzed. The results show that the heating process has the obvious influence on the mass distribution and disassembling has almost no effect on the crushing effect. The liberation is easiest for the circuit boards after heating and is difficult for the circuit boards after disassembling. Considering the impact of environment and investment, the waste phone’s circuit boards can be directly crushed without disassembling and heating treatment.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2015 3rd International Conference on Machinery, Materials and Information Technology Applications
Series
Advances in Computer Science Research
Publication Date
November 2015
ISBN
978-94-6252-120-9
ISSN
2352-538X
DOI
10.2991/icmmita-15.2015.146How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Hongjun Liu
AU  - Zhengdong Qi
PY  - 2015/11
DA  - 2015/11
TI  - Effect of Pretreatment on Crushing Process of Waste Phone's Circuit Boards by Mechanical–physical Method
BT  - Proceedings of the 2015 3rd International Conference on Machinery, Materials and Information Technology Applications
PB  - Atlantis Press
SP  - 776
EP  - 780
SN  - 2352-538X
UR  - https://doi.org/10.2991/icmmita-15.2015.146
DO  - 10.2991/icmmita-15.2015.146
ID  - Liu2015/11
ER  -