Proceedings of the 8th International Conference on Financial Innovation and Economic Development (ICFIED 2023)

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Study on the Main Contents of the Fiscal Measures of the U.S. Chip Act and Their Actionability Under the WTO Perspective

Authors
Tehong Ye1, *
1School of Law, Guangdong University of Foreign Study, Guangzhou, China
*Corresponding author. Email: nelsonye2022@163.com
Corresponding Author
Tehong Ye
Available Online 15 May 2023.
DOI
10.2991/978-94-6463-142-5_29How to use a DOI?
Keywords
unilateral protectionism; the fiscal measures of the U.S. Chip Act; WTO; actionable subsidy
Abstract

Against the background of the prevalence of unilateral protectionism and the obstruction of WTO multilateral trade system reform, the United States provides huge financial subsidies and tax credits to its semiconductor industry and related enterprises through the Chip Act in an attempt to enhance the competitiveness of the U.S. semiconductor industry and dominate the international semiconductor market. Through a combination of literature review and case analysis, the main contents of the fiscal measures of the Chip Act are clarified, and its actionability is analyzed in conjunction with the SCM agreement, and it is found that it meets the general conditions of subsidies and has the characteristics of specificity, and at the same time causes damage to other countries’ industries, which constitutes an actionable subsidy. Other countries can take unilateral countermeasures accordingly, or resort to multilateral dispute settlement bodies such as WTO.

Copyright
© 2023 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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Volume Title
Proceedings of the 8th International Conference on Financial Innovation and Economic Development (ICFIED 2023)
Series
Advances in Economics, Business and Management Research
Publication Date
15 May 2023
ISBN
978-94-6463-142-5
ISSN
2352-5428
DOI
10.2991/978-94-6463-142-5_29How to use a DOI?
Copyright
© 2023 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

Cite this article

risenwbib
TY  - CONF
AU  - Tehong Ye
PY  - 2023
DA  - 2023/05/15
TI  - Study on the Main Contents of the Fiscal Measures of the U.S. Chip Act and Their Actionability Under the WTO Perspective
BT  - Proceedings of the 8th International Conference on Financial Innovation and Economic Development (ICFIED 2023)
PB  - Atlantis Press
SP  - 261
EP  - 267
SN  - 2352-5428
UR  - https://doi.org/10.2991/978-94-6463-142-5_29
DO  - 10.2991/978-94-6463-142-5_29
ID  - Ye2023
ER  -