Research on Chip Cooling of High Power Density Integrated

DOI

10.2991/icemie-16.2016.46How to use a DOI?

Keywords

micro-channel; integrated chip cooling; the numerical simulation; micro-fluidic

Abstract

Increasingly, heat flux density on one chip reached to 1KW/cm2 with the development of integration technology. However, it is hardly to meet the demand of 417K for conventional cooling way. Chip cooling become the bottleneck of integration further. This paper put forward that integrated micro channel in the chip, through which the micro fluid could transfer internal heat to the external. According to the actual working conditions, entrance flow speed and temperature could be adjusted to ensure the normal work of the chip. Firstly, analog chips model including unknown size micro channel was designed. Secondly, the ANYSIS software was adopted to find the proper size. Moreover, size 40 m micro channel could satisfy the high temperature on chip was 413K approximately. Furthermore, the situation of bi-direction flow, changed entrance velocity and entrance temperature was considered to reach the optimized result. It indicated that the chip cooling with micro-channel was feasible.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Shufang Wang
AU  - Zhiyong Yang
AU  - Wei Xi
PY  - 2016/04
DA  - 2016/04
TI  - Research on Chip Cooling of High Power Density Integrated
BT  - Proceedings of the 2016 International Conference on Electrical, Mechanical and Industrial Engineering
PB  - Atlantis Press
SP  - 186
EP  - 189
SN  - 2352-5401
UR  - https://doi.org/10.2991/icemie-16.2016.46
DO  - 10.2991/icemie-16.2016.46
ID  - Wang2016/04
ER  -