Failure characters and damage mechanism of Sn3.0Ag0.5Cu/Cu solder joints under shear thermal cycling

DOI

10.2991/iceep-18.2018.202How to use a DOI?

Keywords

Lead-free solder; Solder joints; Thermal fatigue; Stress

Abstract

The failure characters and damage mechanism of Sn3.0Ag0.5Cu/Cu as-reflowed solder joints under shear thermal cycling were investigated by special shape design for the experiment sample in this paper. The results indicate that fatigue damage mainly occurred within the solder far from the interconnection interface of edge solder joints. The microcracks initiated and propagated along the grain boundaries of β-Sn. The thermal damages of as-reflowed solder joints were attributed to the anisotropy of β-Sn in the coefficient of thermal expansion and the geometry constraint of substrates and interfacial intermetallics compounds layer.

Copyright

© 2018, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Linmei Yang
AU  - Xiying Piao
PY  - 2018/09
DA  - 2018/09
TI  - Failure characters and damage mechanism of Sn3.0Ag0.5Cu/Cu solder joints under shear thermal cycling
BT  - Proceedings of the 2018 7th International Conference on Energy and Environmental Protection (ICEEP 2018)
PB  - Atlantis Press
SP  - 1148
EP  - 1151
SN  - 2352-5401
UR  - https://doi.org/10.2991/iceep-18.2018.202
DO  - 10.2991/iceep-18.2018.202
ID  - Yang2018/09
ER  -