Thermal Expansion Coefficient of Cr(Ti)-Diamond/Copper Composites Prepared by Pressureless Infiltration

DOI

10.2991/icectt-15.2015.94How to use a DOI?

Keywords

Composites; Thermal properties; Coatings

Abstract

Ti(Cr)-diamond/copper composites were fabricated by infiltrating liquid copper into porous diamond preforms without pressure. Thermal expansion properties were measured from 50 to 500 °C by high-precision thermomechanical analyzer. The examination results were analyzed and compared to the predictions of theoretical models. The results indicate that the CTE of Cr(Ti)-diamond/copper composites are among 2-8 10-6k-1, and the increase trend of CTE of Cr-diamond/copper composites is slower than that of Ti-diamond/copper composites with an increase of temperature. The Turner or German theoretical model are more suitable for designing and evaluating the CTEs of Ti(Cr)-diamond/copper composites.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Yinghu Dong
AU  - Dechang Zeng
AU  - Ruiqing Zhang
AU  - Qingjun Chen
PY  - 2015/11
DA  - 2015/11
TI  - Thermal Expansion Coefficient of Cr(Ti)-Diamond/Copper Composites Prepared by Pressureless Infiltration
BT  - Proceedings of the 2015 International Conference on Electromechanical Control Technology and Transportation
PB  - Atlantis Press
SP  - 493
EP  - 496
SN  - 2352-5401
UR  - https://doi.org/10.2991/icectt-15.2015.94
DO  - 10.2991/icectt-15.2015.94
ID  - Dong2015/11
ER  -