Proceedings of the 2nd International Conference on Computer Science and Electronics Engineering (ICCSEE 2013)

Simulation design of a circular wave-guide phase equalizer

Authors
Linchuan Yang, Dewei Zhang, Dongfang Zhou
Corresponding Author
Linchuan Yang
Available Online March 2013.
DOI
10.2991/iccsee.2013.273How to use a DOI?
Keywords
Phase Equalizer, Circular Wave-guide, Metal Screws
Abstract

In this paper, theoretical analysis of phase equalization technology is carried on, and phase characteristics of the circular wave-guide loaded metal screws is studied. On this basis, a Ku-band circular wave-guide phase equalizer is proposed. Simulation analysis with the electromagnetic simulation software HFSS shows that the amount of the insertion phase shift can be effectively controlled by adjusting the parameters of the diameter and length of the circular wave-guide, the diameter, insertion depth, e number and spacing of the screws.

Copyright
© 2013, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Download article (PDF)

Volume Title
Proceedings of the 2nd International Conference on Computer Science and Electronics Engineering (ICCSEE 2013)
Series
Advances in Intelligent Systems Research
Publication Date
March 2013
ISBN
978-90-78677-61-1
ISSN
1951-6851
DOI
10.2991/iccsee.2013.273How to use a DOI?
Copyright
© 2013, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Linchuan Yang
AU  - Dewei Zhang
AU  - Dongfang Zhou
PY  - 2013/03
DA  - 2013/03
TI  - Simulation design of a circular wave-guide phase equalizer
BT  - Proceedings of the 2nd International Conference on Computer Science and Electronics Engineering (ICCSEE 2013)
PB  - Atlantis Press
SP  - 1088
EP  - 1091
SN  - 1951-6851
UR  - https://doi.org/10.2991/iccsee.2013.273
DO  - 10.2991/iccsee.2013.273
ID  - Yang2013/03
ER  -