Analysis signal transitions characteristics of BGA-via multi-chip module

DOI

10.2991/iccsae-15.2016.102How to use a DOI?

Keywords

structural parameters; BGA solder joint; vertical via; return loss

Abstract

BGA-via multi-chip module(MCM) was built by HFSS software, the return loss and insertion loss of MCM were obtained with different frequencies. The impacts of structure parameters included BGA radius, shield ring radius, the bonding pad radius and vertical hole apart from the shield hole distance on the return loss were studied. Studying results show that within a certain range, the return loss of BGA-via firstly increases then decreases as the increase of BGA radius, and the return loss decreases as the increase of shield ring radius, the anti-pad radius and vertical hole apart from the shield hole distance.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Download article (PDF)

TY  - CONF
AU  - Baolin Zhou
AU  - Dejian Zhou
PY  - 2016/02
DA  - 2016/02
TI  - Analysis signal transitions characteristics of BGA-via multi-chip module
BT  - Proceedings of the 2015 5th International Conference on Computer Sciences and Automation Engineering
PB  - Atlantis Press
SP  - 555
EP  - 559
SN  - 2352-538X
UR  - https://doi.org/10.2991/iccsae-15.2016.102
DO  - 10.2991/iccsae-15.2016.102
ID  - Zhou2016/02
ER  -