Bond Graph Modeling and Simulation of Thermal Equipment Based on Modelica

DOI

10.2991/iccasm.2012.92How to use a DOI?

Keywords

bond graph, Modelica, modeling, simulation

Abstract

Bond graph was introduced to establish different domain system models by using numerable basic elements. Modelica is an object-oriented modeling language for multidomain system unified modeling, which can compile simulation model for different modeling method, thus developing bond graph model by Modelica language is well suited for multi-domain unified modeling. In the present paper, Bond Graph library BondLib was introduced and improved. We use Deaerator system as an application example to show results on Dymola platform. The digital simulation results obtained from the bond graph model are validated with the operating characteristics.

Copyright

© 2012, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Download article (PDF)

TY  - CONF
AU  - Guoqing Zhu
AU  - Gang Cheng
PY  - 2012/08
DA  - 2012/08
TI  - Bond Graph Modeling and Simulation of Thermal Equipment Based on Modelica
BT  - Proceedings of the 2012 International Conference on Computer Application and System Modeling (ICCASM 2012)
PB  - Atlantis Press
SP  - 367
EP  - 370
SN  - 1951-6851
UR  - https://doi.org/10.2991/iccasm.2012.92
DO  - 10.2991/iccasm.2012.92
ID  - Zhu2012/08
ER  -