Proceedings of the 2023 2nd International Conference on Artificial Intelligence, Internet and Digital Economy (ICAID 2023)

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Materials Packing Integration Platform Based on Spatial Planning Algorithm

Authors
Huiting Sun1, Lijie Cui1, *, Jiafu Wang1, Jun Wang1, Chenbo Ding1, Enze Zhang1, Jingxian Zhang1
1Air Force Engineering University, Xi’an, 710051, China
*Corresponding author. Email: lijie_cui@163.com
Corresponding Author
Lijie Cui
Available Online 28 August 2023.
DOI
10.2991/978-94-6463-222-4_46How to use a DOI?
Keywords
Material packing; Integrated platform; Spatial planning; Method optimization
Abstract

In view of the modern logistics transportation in the number of materials, miscellaneous types of the situation, the integrated material packing optimization platform of “front-end scanning data--algorithm optimization scheme--terminal output results” is proposed, which the spatial planning algorithm is used to generate and optimize the binning scheme, and the corresponding technical implementation means are given. The packing platform proposed in this paper can effectively save manpower, reduce space cost and improve loading efficiency, which has strong feasibility and reference.

Copyright
© 2023 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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Volume Title
Proceedings of the 2023 2nd International Conference on Artificial Intelligence, Internet and Digital Economy (ICAID 2023)
Series
Atlantis Highlights in Intelligent Systems
Publication Date
28 August 2023
ISBN
978-94-6463-222-4
ISSN
2589-4919
DOI
10.2991/978-94-6463-222-4_46How to use a DOI?
Copyright
© 2023 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

Cite this article

risenwbib
TY  - CONF
AU  - Huiting Sun
AU  - Lijie Cui
AU  - Jiafu Wang
AU  - Jun Wang
AU  - Chenbo Ding
AU  - Enze Zhang
AU  - Jingxian Zhang
PY  - 2023
DA  - 2023/08/28
TI  - Materials Packing Integration Platform Based on Spatial Planning Algorithm
BT  - Proceedings of the 2023 2nd International Conference on Artificial Intelligence, Internet and Digital Economy (ICAID 2023)
PB  - Atlantis Press
SP  - 429
EP  - 436
SN  - 2589-4919
UR  - https://doi.org/10.2991/978-94-6463-222-4_46
DO  - 10.2991/978-94-6463-222-4_46
ID  - Sun2023
ER  -