Thermal Management of The Die Bonding Architecture in 3D-Ics
- DOI
- 10.2991/icaees-15.2015.1How to use a DOI?
- Keywords
- Stack package, Bonding architectures, Microchannels, Thermal Management.
- Abstract
This paper presents the thermal impact of different bonding architectures in the 3D stacked chip.ANSYS® Workbench™14.0 was used to model the architecture and meshed analysis was conducted. Bonding architectures that evaluated were face-to-face, face-to-back and back-to-back while all the parameters and boundary conditions were held constant. A futher discussion is the effect of changing the corresponding parameters or the boundary conditions in the thermal management performance. In that light, a list of cases consisting of increasing the heat transfer co-efficient on top of the package, improving the thermal conductivity of the bonding-layer, the TIM and the package as well as the using of microchannels were evaluated. Simulation results shows that the different bonding architecture has little impact on the maximum temperature of 3D stacked chip that without microchannels. When the microchannels are introduced, the bonding architecture has the important impact. Moreover, from the point of the thermal management performance, it found that changing only one single parameter can decrease little the maximum temperature. The case of intruducing microchannels offered significant improvement in thermal performance.
- Copyright
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Kangjia Wang AU - Zhongliang Pan PY - 2015/07 DA - 2015/07 TI - Thermal Management of The Die Bonding Architecture in 3D-Ics BT - Proceedings of the 3rd International Conference on Advances in Energy and Environmental Science 2015 PB - Atlantis Press SP - 1 EP - 6 SN - 2352-5401 UR - https://doi.org/10.2991/icaees-15.2015.1 DO - 10.2991/icaees-15.2015.1 ID - Wang2015/07 ER -