Higher Order Crack-Tip Fields for Anti-plane Crack in Exponential Functionally Graded Piezoelectric Materials

DOI

10.2991/ic3me-15.2015.335How to use a DOI?

Keywords

crack tip fields, FGPMs, eigen-expansion method , anti-plane crack.

Abstract

The near-tip fields of an anti-plane crack in functionally graded piezoelectric materials(FGPMs) are investigated. To make the analysis tractable as usual, the elastic stiffness, piezoelectric parameter, and dielectric permittivity of FGPMs are assumed to be exponential functions of x parallel to the crack. The boundary conditions on crack surfaces are assumed to be the stress free and electrically impermeable. The high order crack tip stress and electric displacement fields are obtained by the eigen-expansion method. This study possesses fundamental significance as Williams’ solution to homogeneous materials.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Download article (PDF)

TY  - CONF
AU  - Xiao Chong
AU  - Yao Dai
AU  - Dianhui Hou
AU  - Junguo Ma
PY  - 2015/08
DA  - 2015/08
TI  - Higher Order Crack-Tip Fields for Anti-plane Crack in Exponential Functionally Graded Piezoelectric Materials
BT  - Proceedings of the 3rd International Conference on Material, Mechanical and Manufacturing Engineering
PB  - Atlantis Press
SP  - 1740
EP  - 1743
SN  - 2352-5401
UR  - https://doi.org/10.2991/ic3me-15.2015.335
DO  - 10.2991/ic3me-15.2015.335
ID  - Chong2015/08
ER  -