Proceedings of the 2nd International Conference on Electronic & Mechanical Engineering and Information Technology (EMEIT 2012)

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Study on Modification of Phenol Formaldehyde Resin Adhesive with Ionic Liquid

Authors
Liying Guo, Liyan Wang, Jixin Li
Corresponding Author
Liying Guo
Available Online September 2012.
DOI
10.2991/emeit.2012.422How to use a DOI?
Keywords
Ionic liquid, Phenol formaldehyde resin, Adhesive, Tensile shear strength
Abstract

Ionic liquid [HeMIM]Cl was prepared and then used to synthesize phenol formaldehyde resin adhesive by in-situ blending with phenol and formaldehyde using base catalyst. The chemical structure of hybrid adhesive was characterized by FT-IR, as well as the effects of the ionic liquid amount, the molar ratio of phenol to formaldehyde and the catalyst dosage on the properties of adhesive were investigated. The results showed that the adhesion properties of phenol formaldehyde resin were improved significantly by the modification with ionic liquid. When the molar ration of phenol to formaldehyde was 1:2, the amount of ionic liquid was over 15%, and the catalyst dosage was no less than 1%, the adhesion properties of phenol formaldehyde resin were the best.

Copyright
© 2012, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2nd International Conference on Electronic & Mechanical Engineering and Information Technology (EMEIT 2012)
Series
Advances in Intelligent Systems Research
Publication Date
September 2012
ISBN
978-90-78677-60-4
ISSN
1951-6851
DOI
10.2991/emeit.2012.422How to use a DOI?
Copyright
© 2012, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

risenwbib
TY  - CONF
AU  - Liying Guo
AU  - Liyan Wang
AU  - Jixin Li
PY  - 2012/09
DA  - 2012/09
TI  - Study on Modification of Phenol Formaldehyde Resin Adhesive with Ionic Liquid
BT  - Proceedings of the 2nd International Conference on Electronic & Mechanical Engineering and Information Technology (EMEIT 2012)
PB  - Atlantis Press
SP  - 1910
EP  - 1913
SN  - 1951-6851
UR  - https://doi.org/10.2991/emeit.2012.422
DO  - 10.2991/emeit.2012.422
ID  - Guo2012/09
ER  -