Proceedings of the 2016 5th International Conference on Environment, Materials, Chemistry and Power Electronics

When ECAD meets MCAD - the design pattern of innovation

Authors
Jing Wang, TingTing Liu
Corresponding Author
Jing Wang
Available Online August 2016.
DOI
10.2991/emcpe-16.2016.119How to use a DOI?
Keywords
Electronic CAD, Machinery CAD, 3D model, Synchronous design
Abstract

When the electronic computer aided design (ECAD) meets the mechanical computer aided design (MCAD), the process, method and scheme of the design in the new electronic products will have a qualitative leap, and the three-dimensional (3D) design is one of the best ways to realize the improvement of new production quality. 3D design could accurately express the engineer's design ideas, according with engineers' thinking mode and design habits. In the design of new products, engineers could import the three-dimensional model of the electronic products to MCAD software, then mechanical designers are expected to observe the appearance comprehensively and objectively, design its mechanical, structure and shell. Experimental results indicate that the proposed method could predict the actual effect of the new product in advance, avoiding the mismatch between the electronic products and the mechanical casing. Also it will greatly improve the design efficiency and design quality, achieving the synchronous design of the electronic and mechanical products and actualize the integration of design and manufacture.

Copyright
© 2016, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2016 5th International Conference on Environment, Materials, Chemistry and Power Electronics
Series
Advances in Engineering Research
Publication Date
August 2016
ISBN
978-94-6252-197-1
ISSN
2352-5401
DOI
10.2991/emcpe-16.2016.119How to use a DOI?
Copyright
© 2016, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Jing Wang
AU  - TingTing Liu
PY  - 2016/08
DA  - 2016/08
TI  - When ECAD meets MCAD - the design pattern of innovation
BT  - Proceedings of the 2016 5th International Conference on Environment, Materials, Chemistry and Power Electronics
PB  - Atlantis Press
SP  - 400
EP  - 405
SN  - 2352-5401
UR  - https://doi.org/10.2991/emcpe-16.2016.119
DO  - 10.2991/emcpe-16.2016.119
ID  - Wang2016/08
ER  -