A concise modeling methodology and its application in thermal system

DOI

10.2991/eame-15.2015.213How to use a DOI?

Keywords

thermal system; circuit network methodology; modelling; bond graph; heat transfer

Abstract

The paper presents an interesting method for the derivation of transfer function from passive RCL-networks (Resistance, Capacitance and Inductance) with a ladder structure. In this paper, circuit network modeling methodology is extended into thermal system. In order to apply directly the methodology to thermal system, firstly pseudo bond graph method, as an intermediary, is utilized to depict the model of thermal system, secondly the model is transformed into its equivalent circuit diagram, finally according to the methodology, the mathematical model in format of transfer function of thermal system can be rapidly obtained by observing circuit diagram alone. Through a modeling example of heat transfer in building envelope wall, it has been verified that the mathematical models obtained by circuit network modeling methodology and pseudo bond graph method are identical, but this methodology has the advantages of simplicity, convenience, rapidness and intuitiveness in manual derivation of transfer function of thermal system.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Y. Lu
AU  - X.J. Chen
AU  - X.K. Zhang
PY  - 2015/07
DA  - 2015/07
TI  - A concise modeling methodology and its application in thermal system
BT  - Proceedings of the 2015 International Conference on Electrical, Automation and Mechanical Engineering
PB  - Atlantis Press
SP  - 790
EP  - 794
SN  - 2352-5401
UR  - https://doi.org/10.2991/eame-15.2015.213
DO  - 10.2991/eame-15.2015.213
ID  - Lu2015/07
ER  -