Study on preparing single–component flow–type EP underfill adhesive

DOI

10.2991/asei-15.2015.390How to use a DOI?

Keywords

epoxy, conductive adhesive, electronics, dicyandiamide(DCA), thermal conductivity

Abstract

With EP(epoxy resin) as matrix resin, DCA(dicyandiamide) as curing agent and modified imidazole as curing accelerator, and adding fillers and other additives, a single–component flow–type EP underfill adhesive was prepared. The curing temperature was determined by testing gelation time and characterizing FT-IR(infrared spectroscopy). And the influences of fillers types and proportions on the viscosity, thermal conductivity, dielectric constant and bonding strength of adhesives were discussed. The research results indicated that the adhesive had good combination property and could fully meet the application requirements. when mass ratios of m(EP):m(DCA):m(modified imidazole) was 100:8:5, w(filler)was 60% in EP and m(Al2O3):m(SiO2) was 1:5, and mass fractions of silane coupling agent and dispersing agent were all 0.5% in EP, and curing process was “85°C/30min 120°C/1h”(cured for 30 minutes at 85°C, and cured for 1h at 120°C), Its shear strength was 15.33 MPa, thermal conductivity was 0.793 W/(m.K), and viscosity was 6.06 Pa.S.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Huilu Li
AU  - Hongli Wei
AU  - Kangchen Shao
AU  - Ting Zhang
PY  - 2015/05
DA  - 2015/05
TI  - Study on preparing single–component flow–type EP underfill adhesive
BT  - Proceedings of the 2015 International conference on Applied Science and Engineering Innovation
PB  - Atlantis Press
SP  - 1976
EP  - 1980
SN  - 2352-5401
UR  - https://doi.org/10.2991/asei-15.2015.390
DO  - 10.2991/asei-15.2015.390
ID  - Li2015/05
ER  -