Research on Effective Thermal Conductance of the Microbolometer
Authors
L. Zhang, C. Chen, T. Wang, Y. Zhao
Corresponding Author
L. Zhang
Available Online July 2015.
- DOI
- 10.2991/aiie-15.2015.160How to use a DOI?
- Keywords
- a three-level model; microbolometer; finite element simulation; device thermal conductance; effective thermal conductance; dynamic thermoelectric coupling
- Abstract
A three-level model of microbolometer was established by the software of intellisuit. Device thermal conductance Gdev, effective thermal conductance Geff and the theoretical value of device thermal conductance Gthe can be obtained by means of dynamic thermal finite element simulation, dynamic thermoelectric coupling finite element simulation and theoretical calculations respectively. And then the three parameters mentioned above were analyzed and conclusion can be drawn that effective thermal conductance Geff extracted not only can provide some important references for design of microbolometer, but also be more accurate in performance estimating of the device.
- Copyright
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - L. Zhang AU - C. Chen AU - T. Wang AU - Y. Zhao PY - 2015/07 DA - 2015/07 TI - Research on Effective Thermal Conductance of the Microbolometer BT - Proceedings of the 2015 International Conference on Artificial Intelligence and Industrial Engineering PB - Atlantis Press SP - 601 EP - 604 SN - 1951-6851 UR - https://doi.org/10.2991/aiie-15.2015.160 DO - 10.2991/aiie-15.2015.160 ID - Zhang2015/07 ER -